RF and Microwave Microelectronics Packaging II: 2 by Ken Kuang
English | 22 Mar. 2017 | ISBN: 3319516965 | 186 Pages | PDF | 6.24 MB
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.